Hot Embrossing, Nanoimprinting
Hot Embrossing, Nanoimprinting
- Fabrication of microstructures and nanostructures in polymers with high aspect ratios
- Applications in MEMS, BIOMEMS and Microfluidics
- Mold non-orthgonality compensation
- Automatic mold release
- Automatic production system (HEX04)
- Temperature up to 320 °C (500 °C)
- Optoelectronic overlay alignment system for hybrid applications or double-sided embossing